技术参数

• Part Status Active
• Core Processor ARM® Cortex®-A55, ARM® Cortex®-M33
• Number of Cores/Bus Width 2 Core, 64-Bit
• Speed 250MHz, 1.7GHz
• Co-Processors/DSP Multimedia; NEON™ MPE
• RAM Controllers LPDDR4
• Graphics Acceleration No
• Display & Interface Controllers LCD, LVDS, MIPI-CSI, MIPI-DSI
• Ethernet GBE (2)
• SATA -
• USB USB 2.0 (2)
• Voltage - I/O 1.8V
• Operating Temperature -40°C ~ 125°C (TJ)
• Security Features Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
• Mounting Type Surface Mount
• Package / Case 306-LFBGA, FCBGA
• Supplier Device Package 306-FCBGA (14x14)
• Additional Interfaces CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
• RoHS Status ROHS3 Compliant
• REACH Status REACH Unaffected